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#packaging
Every story tagged packaging, newest first.
CoWoS, SoIC, and Foveros: How Advanced Chip Packaging Actually Works
Modern chips are split into many dies, then wired back together in the package. Three technologies do that reintegration: TSMC's CoWoS and SoIC and Intel's Foveros and EMIB. Here is how 2.5D and 3D packaging physically differ, what the CoWoS variants change, and why the packaging line, not the
Ahmad J · Jul 30, 2026 · 11 min read
HBM Explained: Why High-Bandwidth Memory Is the Real Bottleneck in AI Chips
Peak FLOPS are a distraction. The real constraint in every AI accelerator is how fast memory can feed the compute, and HBM is that constraint. Here is how it is built, why inference is memory-bound, why HBM4 doubles the bus instead of the clock, and why packaging, not silicon, is the supply
Ahmad J · Jul 29, 2026 · 12 min read
What Chiplets Are and Why Chipmakers Moved to Them
Modern high-end processors are not one slab of silicon anymore. They are smaller dies stitched together in a package. The reasons come down to yield, the reticle limit, and cost per transistor. Here is how chiplets actually work, and the engineering trade they make.
Ahmad J · Jul 28, 2026 · 10 min read